A pure-Lagrangian finite element approach for solving thermo-electrical-mechanical models. Application to electric upsetting
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Elsevier
Abstract
In this paper, we introduce a novel numerical procedure for solving fully coupled thermo-electrical-mechanical problems using implicit Runge–Kutta time integration within a purely Lagrangian finite element framework. Our formulation, grounded in continuum mechanics, accurately captures the interdependence of mechanical, thermal, and electrical effects under large deformations. It features a fully coupled thermo-electrical-mechanical Lagrangian model with an elasto-viscoplastic constitutive law, considers six primary variables –velocity, temperature, electric potential, plastic deformation gradient, an internal strain hardening variable, and a Lagrange multiplier for enforcing contact conditions– and employs a pure-Lagrangian description. This ensures the computational domain remains fixed and known a priori, simplifies the tracking of free surfaces, and eliminates convective terms. To validate our approach, we solve several axisymmetric benchmark problems and analyze convergence rates in both time and space. Moreover, our numerical results show excellent agreement with the solution obtained using commercial packages for an in-die electric upsetting process.
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Benítez, M., Bermúdez, A., Fontán, P., Martínez, I., & Salgado, P. (2025). A pure-Lagrangian finite element approach for solving thermo-electrical-mechanical models. Application to electric upsetting. Finite Elements in Analysis and Design, 251, 104433. 10.1016/j.finel.2025.104433
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https://doi.org/10.1016/j.finel.2025.104433Sponsors
The research has been developed in collaboration with CIE Galfor through a project granted by the Centre for the Development of Industrial Technology (CDTI) and signed between the company CIE Galfor and Itmati (nowadays, integrated in CITMAga). This work has been partially funded by MCIN /AEI /10.13039/501100011033/FEDER, UE under research Project PID2021-122625OB-I00.
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© 2025 The Authors. Published by Elsevier B.V. This is an open access article under the CC BY license (http://creativecommons.org/licenses/by/4.0/).
Attribution 4.0 International
Attribution 4.0 International







